Volume Production For TSMC’s 3nm Chips to Kick Off in the Second Half of This Year
DigiTimes report that TSMC is on track to begin volume production of its 3nm chips in the second half of this year. The supplier is expected to process 30,000 to 35,000 wafers manufactured through the 3nm process technology. The publication cites that Apple will use the 3nm chip initially on its iPad but no models have been mentioned so far. Apple will use the chips manufactured through TSMC’s 3nm process in 2023. Apple chips based on TSMC’s 3nm process will be used for the iPhone, iPad, as well as Macs. What users can expect is improved performance and better battery life due to the less power-hungry nature of the chips. Apple’s M3 chips for Macs are rumored to have up to four dies which will allow up to a 40-core CPU. In contrast, the M1 chip only features an 8-core CPU while the M1 Pro and M1Max chip feature a 10-core CPU. We will share more details on TSMC’s 3nm chips as soon as further details are available. What are your expectations from Apple this year? Let us know in the comments.
